Measurement of local coefficients of thermal expansion (CTE) and local deformation/strain behavior under thermal load directly on the PCB.
- Thermo-mechanical measurements from -40° - to 300°C
- Determination of thermal expansion coefficients (CTE) in local areas of the printed circuit board » real material data for FE simulations
- Determination of critical temperature-related strains and deformations » Avoidance of early damage to the solder joints
- Reliability and lifetime analysis of electronic connections
Do you need the measurement equipment in-house? Offer for the microDAC® TL measuring system and the VEDDAC 7 image analysis software: Contact us by email at email@example.com