Thermomechanical stress of electronic systems

Measurement of local coefficients of thermal expansion (CTE) and local deformation/strain behavior under thermal load directly on the PCB.

microDAC® TL

We will be happy to support you on a contract basis:
  • Thermo-mechanical measurements from -40° - to 300°C
  • Determination of thermal expansion coefficients (CTE) in local areas of the printed circuit board
    » real material data for FE simulations
  • Determination of critical temperature-related strains and deformations
    » Avoidance of early damage to the solder joints
  • Reliability and lifetime analysis of electronic connections

Do you need the measurement equipment in-house?
Offer for the microDAC® TL measuring system and the VEDDAC 7 image analysis software:
Contact us by email at

IMAPS - Event "THERMAL 2023"

Michael Eichhorst, our Head of Research and Development, was present at the IMAPS - Event "THERMAL 2023" in France from March 08-09 with the following presentation:

Thermomechanical investigation of microelectronics at the component and system level

The goal must be to predict the failure and remaining lifetime of electronic components before a defect leads to system failure. In the lecture, current results of reliability investigations of electronic assemblies on component and system level under thermal stress were discussed. In particular, deformation analyses using digital image correlation (DIC) for thermo-mechanical characterization of electronic systems were presented. From the results and in combination with FE simulations, statements on degradation, failure and failure behavior are derived. The results are also used to calibrate models for residual life predictions.

IMAPS 2023
Microscopy conference MC2023!

from Feb 27th - Mar 2nd, 2023 in Darmstadt together with Kammrath & Weiss GmbH

New product innovations:
Extensions of the proven Kammrath & Weiss microloading systems with
  • Heating/cooling function
  • Additional fatigue module
  • Videoextensometer microDAC® strain
  • Image analysis software VEDDAC 7 for local strain analysis on camera or SEM images

Videoextensometer microDAC® strain auf der größten Mikroskopie-Konferenz MC2023 in Darmstadt

Visit us at the company booth of Kammrath & Weiss E1-8!

MC2023-Videoextensometer Thumbnail

With the microDAC® strain video extensometer for tension/compression modules from Kammrath & Weiss, longitudinal and transverse strain are automatically measured with high precision directly on the material surface during a tension/compression load. From this, the real material characteristics for the material can then be determined.

The video extensometer is used for tensile/compression tests in the scanning electron microscope (SEM) as well as in camera-based systems (microscope, industrial camera).

  • automated - in situ - strain determination
  • robust image analysis algorithms - no markers required
    also works for low structure and noisy SEM images
  • non-contact - for sensitive materials, thermal tensile tests
  • Image material is available for further image analysis with VEDDAC 7 - Determination and display of local deformation and strain fields

For questions and further product information +++ also about the extensive product portfolio of Kammrath & Weiss +++ we are looking forward to meeting you at the MC2023 in Darmstadt


you are welcome to reply by email:

CWM at the 6th Jena µCT Workshop on 23.11.2022 (University Hospital Jena)

Presentation of VEDDAC volume - our software for Digital Volume Correlation (DVC) and results of the joint research project RemaKeBone.

VEDDAC volume - is a stand-alone intuitive measurement software for the determination of 3D deformation fields and for the analysis of structural changes (e.g. cracking) inside materials based on X-ray computed tomography (CT) images.

In the RemaKeBone project (funded by the BMBF), 3D-printable bone-equivalent test materials are being developed together with partners for the realistic replication of biomechanical bone properties based on 4D deformation analysis. For the biomechanical characterization, CWM's DVC method is used on X-ray CT images with new loading technology. For this purpose, the CWM project team is developing new accelerated algorithms for DVC with even higher accuracy, which will of course then also be integrated into our DVC software VEDDAC volume.

ReMakeBone DVC worksheet
Funded within the framework of KMU-innovativ by the BMBF under FKZ: 13XP5100

For CWM, it is the entry into biomedicine with VEDDAC volume!

VEDDAC volume - For all who work with X-ray CT!

Now gain even more information from your CT data: By deformation analysis with the DVC software VEDDAC volume on CT data of an object before/during (in-situ) or before/after a load (ex-situ).

Regardless of whether in-situ or ex-situ: The result of the calculation shows the smallest changes in the material - and that in the sub-voxel range. VEDDAC volume is therefore an indispensable tool for early detection of material failure (e.g. later cracks or otherwise hardly visible cracks). Seeing gradients in deformation and strain - essential for the evaluation of the structure in complex structures (e.g. lightweight construction, 3D printing).

Early crack detection - testing on concrete
DVC-Software VEDDAC volume
Early crack detection - testing on concrete (in cooperation with BAM Berlin)
Determination of 3D deformation fields on CT data
DVC-Software VEDDAC volume
Determination of 3D deformation fields on CT data

Advantages of VEDDAC volume:
  • stand-alone software - no basic module required
  • device-independent - works for all reconstructed CT data read in as image stacks
  • clear layout - easy to use
  • strain calculation from local to global - quickly done by a few mouse clicks
  • practical algorithms to choose from - even for noisy data
  • memory-optimized data processing for fluent working
  • 2D or 3D visualization - adaptable for any purpose

Flyer download (deutsch) (english)

New! Digital image correlation software VEDDAC 7

With VEDDAC 7, even more precise and reliable surface image analyses can be performed to characterize motion, deformation and failure. VEDDAC 7 adds many new features to the proven VEDDAC 6 version. With its modern, user-friendly and intuitive program interface, VEDDAC 7 offers the user time-effective image evaluation.

microDAC® strain - With highest precision

With our video extensometer microDAC® strain it is possible to determine longitudinal and transverse strain during tensile and compression tests directly on the specimen without time-consuming specimen preparation, e.g. the application of measuring marks or the spraying on of grey value patterns.

In addition to classic applications in tensile/compression testing equipment, microDAC® strain is also optimized for use in automated strain measurement on tensile/compression loaded specimens in the scanning electron microscope (SEM) as well as for loading equipment for micro tensile specimens from Kammrath & Weiss GmbH.

microDAC® strain works with highest precision of accuracy class 0.2 according to DIN EN ISO 9513.

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